The new adhesive system improves upon the existing T-Link platform by delivering higher ductility, flexural strength, and energy absorption. Internal testing indicates significant gains in material performance, specifically a 66% increase in compressive strength after impact compared to standard epoxy prepreg layers. These metrics, verified under ASTM D7137 and ASTM D2344 standards, highlight the material's ability to maintain structural performance under high flexural loads.
Don Paquet, senior scientist at the company, noted that the technology allows manufacturers to utilize thinner films and monofilaments, effectively reducing weight by placing adhesive only where structural reinforcement is required. Beyond performance, the thermoplastic nature of the product supports potential heat-based repair, debonding, and recycling workflows. The adhesive is currently available in pellet, micropellet, and film formats, with yarn and filament versions currently under development to further expand its application range.
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