Stäubli Integrates Power and Cooling for AI Data Center Infrastructure

The rapid expansion of AI processing power has rendered traditional, siloed infrastructure designs obsolete. By treating power distribution and heat removal as a singular, interconnected challenge, Stäubli is aligning its hardware with the modular demands of modern high-density environments. Their current portfolio for OCP Open Rack v3 architectures includes specialized bus bar electrical connectors alongside non-spill quick couplings designed for high-flow cooling loops.

This dual-track approach addresses the critical space and performance constraints inherent in next-generation server blades and optical modules. Jean Christophe Duisit, who leads high-potential projects for data centers at Stäubli, noted that the industry’s primary hurdle is no longer just capacity, but ensuring both electrical and fluid systems function reliably at scale. The company plans to showcase these integrated connectivity solutions at the upcoming OCP Global Summit in San Jose and the Supercomputing event in Chicago later this year.