The A-725 platform functions by moving across a single reference plane, a departure from conventional stacked configurations that inherently introduce Abbe offsets and geometric inaccuracies. This design choice provides a more stable foundation for sensitive operations such as wafer inspection, laser dicing, and optical alignment. The unit features a 250 mm platform diameter capable of supporting payloads up to 8 kg, with vertical travel of 5 mm and tip/tilt adjustments of ±2°.
To eliminate the friction and cogging associated with mechanical bearings, the system utilizes ironless three-phase linear motors across all five axes. PI delivers the A-725 as a turnkey solution, pre-configured with ACS-based controllers to accelerate deployment in factory environments. Available with XY travel ranges spanning from 100×100 mm to 300×400 mm, the stage is positioned to serve industries requiring rigorous multi-axis alignment and metrology at the nanoscale.
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