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Delta Electronics to Unveil Grid-to-Chip AI Infrastructure in San Jose

As AI processing demands push data center power and thermal limits, Delta Electronics is preparing to showcase an integrated infrastructure suite at the OCP Global Summit 2026. From October 12 to 15, the firm will demonstrate how unifying grid-level energy, power delivery, and liquid cooling can stabilize high-density AI deployments.

Delta Electronics to Unveil Grid-to-Chip AI Infrastructure in San Jose

The company’s strategy centers on a Grid-to-Chip approach, bridging the gap between onsite energy generation and the silicon itself. Austin Tseng, President of Delta Electronics Americas, noted that sustainable AI infrastructure requires energy delivery and thermal management to function as a single, cohesive system. To address this, Delta is introducing solid-state transformer-enabled microgrids that integrate solid oxide fuel cells with intelligent controls, providing operators with more resilient energy sources in the face of increasing grid constraints.

At the rack and chip level, Delta is targeting the thermal challenges inherent in high-performance computing. The showcase will feature the 3MW GoCool system and the Project Deschutes Open In-Row CDU, which is slated for mass production in the first quarter of 2027. These systems utilize N+1 sealless pumps and advanced filtration to maintain uptime for hyperscale environments. Complementing these are 800 VDC power distribution solutions, which the company claims will significantly reduce infrastructure losses while supporting the extreme power density required by modern GPU architectures. Delta technical experts will further detail these power and cooling strategies in dedicated sessions during the summit at the San Jose Convention Center.

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