Ezurio Launches Veda IF912 and IF913 Wireless MCU Modules

The Veda IF912 and IF913 series, powered by Infineon’s AIROC CYW55912 and CYW55913 chipsets, consolidate high-performance connectivity and computing into a 7 x 11 mm surface-mount package. This architecture allows developers to run applications directly on the module in SoC mode or utilize it as a network coprocessor, providing flexibility for diverse hardware requirements. The integrated hardware includes 8 MB of Flash and 8 MB of PSRAM, supporting secure boot, WPA3 security, and Matter networking protocols.

Andy Ross, Senior Product Manager at Ezurio, noted that the integration eliminates the months of design work typically spent syncing a host MCU with a separate radio module. Because the system is pre-certified for global markets—including FCC, IC, CE, and MIC—the modules are designed to accelerate the path to production. The units are currently available through Ezurio’s global distribution network, alongside development kits intended to streamline prototype testing. Shantanu Bhalerao, Vice President of the Wireless Product Line at Infineon, emphasized that the collaboration combines specialized wireless silicon with Ezurio's modular engineering to redefine performance standards for low-power IoT devices.